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Higher power IPMs are constructed using ceramic isolation material. A direct bond copper process in which copper patterns are bonded directly to the ceramic substrate without the use of solder is used in these modules. This substrate provides the improved thermal characteristics and greater current carrying capabilities that are needed in these higher power devices. Gate drive and control circuits are contained on a separate PCB mounted directly above the power devices. The PCB is a multilayer construction with special shield layers for EMI noise immunity. Figure 6.4 shows the structure of a ceramic isolated Intelligent Power MODULE. Figure 6.5 is a PM75RSA060 75 A, 600V IPM.
Figure 6.5 is a PM75RSA060 75A,600V IPM.